Delay Line from ELMEC Technology of America, Inc.

Care and Handling of LTCC Products

Caution
  • Storage Conditions: Temperature: -40°C~+30°C; Humidity: less than 60% Relative Humidity
  • Please store out of the open air and in a location free of corrosive gasses containing Sulfur or Chlorine.
  • Please store out of direct sun light.
  • Please use within one 1 year of receipt. For parts kept over one 1 year, please only use after verifying solderability.
  • Please only use according to the terms and conditions described in this catalog. If used outside these terms, quality may decrease, heat may be generated and breakage may occur.
  • In order to maintain the viability of the part, please connect all GND terminals when using.
  • When using other than the recommended land pattern, be sure to verify the characteristics of the device.
  • When soldering with a soldering iron, please use a point temperature of under 300°C for less than 5 seconds per terminal. When re-working time is too long, it may cause solder leaching, which will cause a reduction of the adhesive strength of the terminations.
  • Do not allow the soldering iron to touch the body of the component.
  • Please keep the solder volume to less than 2/3 the height of the component.
  • If the PCB is badly warped, it may be a cause of breakage or cracking. Please try to prevent warping of PCBs being used. Otherwise, place the component in a location not subject to the stress associated with the warping.
  • Because this is a component which uses ceramic, excessive pressure or shock may cause the body to break. Please take care during transportation and handling.
  • If the component is damaged or chipped, efficiency will drop. Please take care during handling.
  • When cleaning, when using water or water-based products, any remaining moisture may cause the insulation to deteriorate.
  • When using an ultrasonic cleaner, if the output is too great, the PCB may resonate and cause the component to crack.
  • After attaching the component, when removing the component, high-temperature heating may cause the component quality and performance to drop. Please use caution when reusing as a rework component.